PCB Via Fill Affect the Cost of PCB Fabrication
PCB via fill is an important manufacturing step that contributes to the overall cost of a circuit board. It affects the electrical connection between different layers and helps the board perform as designed. This process involves drilling holes in the circuit board and filling them with conductive or non-conductive material. There are several different types of vias, including through-hole, microvia, blind and buried. Vias can be filled with conductive copper or silver, or non-conductive epoxy resin. The type of via fill you choose will have a significant impact on the overall cost of your PCB.
The size and number of drill holes in the board will also have a significant impact on fabrication costs. Larger drill holes require more complex laser drilling techniques than smaller ones, which can drive up the price of production. Also, more holes will take longer to drill than fewer holes, which can increase the total time of production and lead to higher costs.
Add-Ons: Some projects include features that are not standard for the board, such as counter-bores, counter-sinks and complex routing. These extra steps can significantly drive up the cost of the project, as they require additional tooling and advanced techniques to execute properly. It is important to keep these options in mind when planning a budget for your project.
Manufacturer Selection: Choosing a pcb via fill manufacturer with a good reputation, quality standards and production capabilities can help lower your overall fabrication costs. However, each manufacturer has their own pricing structure and capabilities, which can vary widely. Choosing an overly expensive manufacturer will significantly drive up your fabrication costs, while selecting an under-capable one could result in poor performance and failure of your circuit board.
How Does PCB Via Fill Affect the Cost of PCB Fabrication?
Via Fill: Conductive filled vias are generally used for passing signals from the outer layer to the inner layers. The conductive copper helps to efficiently transfer the electric current and reduces the resistance of the via, which improves the signal transmission efficiency of the circuit board.
The other common option is a non-conductive epoxy fill, which allows the via to pass heat and signal while blocking solder from flowing into the hole and damaging the components. This type of fill is a less expensive option, but is not as effective in some applications.
Another option is to plate shut the unused vias in the design, which eliminates the need for filling. This method is more costly, as it requires an extra step of drilling, grinding and brushing the vias before plating, and increases the processing time.
Whether or not you opt for a via fill will depend on the overall functionality of the circuit board. The type of fill you select will have a significant impact on the price of the board, and should be considered carefully when planning your budget. For example, microvias and blind vias are much more expensive than standard through-holes because they require a more sophisticated manufacturing technique, such as sequential lamination.